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Polyimide Resin(100) - List of Manufacturers, Suppliers, Companies and Products

Polyimide Resin Product List

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PI (Polyimide) "6000 Series"

PI (Polyimide) "6000 Series"

Material for machining processed by compression molding of PI.

The "6000 Series" is a machining material made from compressed PI (polyimide). PI resin has high mechanical strength and excellent heat resistance, electrical insulation, and chemical resistance, making it widely used in aerospace, automotive, and electrical and electronic fields. 【Features】 ■ Excellent mechanical properties ■ High heat resistance ■ Glass transition temperature: ~335°C ■ Load deflection temperature: ~320°C *For more details, please refer to the PDF materials on the official website or feel free to contact us.

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  • Other polymer materials

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Precision machining of polyimide resin (PI resin) [SCM8000]

Precision machining of polyimide resin (PI resin) [SCM8000]

We offer precision machining of the SCM8000 from PBI Corporation. We have a large inventory. From small lots of 1 piece to mass production!

The SCM8000 is a machining material made from ultra-high heat-resistant polyimide UPI natural grade, compressed and molded using the PBI method. It features ultra heat resistance, a load deflection temperature of up to 480°C, excellent mechanical properties, good wear resistance, low water absorption, and anti-static/conductive properties. We respond to customer needs with advanced processing technology tailored to the characteristics of PBI resin. 【Key physical properties at 23°C (partial)】 ■ Tensile strength: 100 MPa (Standard ISO 527) ■ Tensile strain: 2.0% (Standard ISO 527) ■ Flexural strength: 190 MPa (Standard ISO 178) ■ Flexural modulus: 7.0 GPa (Standard ISO 178) ■ Charpy impact strength (notched): 1.5 kJ/m² (Standard ISO 179) *You can view our available equipment by downloading the PDF. Please feel free to contact us for any other inquiries.

  • Processing Contract

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Cutting processing material: PI resin (BPDA)

Cutting processing material: PI resin (BPDA)

Biphenyl tetracarboxylic dianhydride (BPDA) and diamine condensation polymerization!

We would like to introduce the cutting processing material "PI resin (BPDA)" that we handle. It is an all-aromatic polyimide resin produced by the polycondensation of biphenyl tetracarboxylic acid dianhydride (BPDA) and diamines. The compression molding grades include "SCP-5000," which excels in dimensional stability under humid conditions, and "SCM8000," which has good wear resistance. 【Features of SCP-5000】 - Improved rigidity and impact strength compared to aromatic polyimide resin SP-1 - Enhanced long-term high-temperature exposure resistance (with a Tg point of 380°C) - Excellent dimensional stability under humid conditions *For more details, please refer to the related links or feel free to contact us.

  • Other polymer materials

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DuPont™ Bespoke® SP-1 for solving vacuum process problems.

DuPont™ Bespoke® SP-1 for solving vacuum process problems.

100% polyimide. It has excellent strength, heat resistance, and electrical properties.

If the materials for processing are in stock, same-day shipping is possible. The size chart is available on our website. Please take a look.

  • Engineering Plastics

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Fundamentals and Applications of Micronization of Polyimide Resin with Heat Resistance and Weather Resistance

Fundamentals and Applications of Micronization of Polyimide Resin with Heat Resistance and Weather Resistance

Is there a technology that can micronize high heat-resistant polyimide? I will teach you a method to mass-produce uniform polyimide microparticles with consistent particle size.

Speaker Dr. Takayuki Ishizaka, Researcher, Compact Chemical Systems Research Center, National Institute of Advanced Industrial Science and Technology (AIST) Target Audience: Engineers, researchers, and beginners interested in polymer microparticles and polyimide technology Venue: Tekno Kawasaki, 4th Floor Exhibition Hall [Kanagawa, Kawasaki City] 5-minute walk from Tokyu Mizonokuchi Station East Exit or JR Musashi-Mizonokuchi Station Date and Time: October 26, 2011 (Wednesday) 13:30-16:30 Capacity: 30 people *Registration will close once full. Please apply early. Participation Fee: [Early Bird Discount Price] 46,200 yen (tax included, including text costs) for up to 2 participants from one company *Limited to Tech-Zone members who apply by October 12. Membership registration is free. *After October 12, the [Regular Price] will be 49,350 yen (tax included, including text costs) for up to 2 participants from one company. ◆If 3 participants from the same organization apply, the fee will be 69,300 yen.

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
  • Technical Seminar

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